The Evolution of High-End Chips: TSMC's Advancements Beyond 3nm
This article discusses the progression of TSMC's high-end chip manufacturing, focusing on technologies beyond the 3nm process, including 2nm, 1.6nm, and 1.4nm. These advanced chips are primarily used in AI computing centers.
2nm Chip Technology
GAA (Gate-All-Around) Architecture
TSMC's 2nm chip marks the introduction of GAA (Gate-All-Around) architecture. The initial flat-screen electric body design had a curved control area, posing challenges as chips shrank. FinFET architecture was adopted from 16nm to 3nm to address this. GAA takes this further by completely surrounding the channel with the gate, offering improved control.
Efficiency of GAA Structure
The GAA structure enhances efficiency, often utilizing multiple nanometer layers (two or three). While machines can handle up to 3nm, Intel's power supply uses 4nm. Reducing by even 1nm is a complex and costly endeavor, impacting yield rates.
Potential of Nanoparticle Stacking
Future advancements may involve unrestricted nanoparticle stacking, leading to faster chip performance. Nanoparticle stacking primarily affects thickness within nanometers, minimally impacting chip size but significantly boosting performance. However, current technology limitations, including cost and structural configuration, restrict extensive stacking.
Enhancements in TSMC's Chip Manufacturing
Improved End-of-Life Film
TSMC's A14 chip incorporates an improved end-of-life film, a second-generation Narrow Shooter, similar to the FinFlex platform. This allows for flexible matching of end-of-life film width and height, optimizing efficiency and power consumption through strategic trade-offs.
Gold-Plated Power Supply (Super Power Rail)
Intel initially proposed the gold-plated power supply technology, known as Super Power Rail in TSMC.
Traditional Power Supply Method
In the traditional method, Xijinyuan films are covered with factory-sale electric crystals which communicate via a signal guide zone. The power supply circuit above connects to an external power source on the PCB board, driving the factory power supply through the signal circuit area. This requires energy to travel a long distance to reach the factory power supply, resulting in an operation order of 1-3-2 (Power Area - Signal Guide - Factory Power).
Gold-Plated Power Supply Advantages
The gold-plated power supply moves the entire power supply to the bottom of the chip, resulting in a direct pathway for power from external sources.
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Shorter Distance: This reduces heat generation, improving heat dissipation.
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Efficient Arrangement: Reclaiming the space of the original power cable allows for more efficient signal cable arrangement.
This design enhances chip efficiency by enabling direct power supply and communication. TSMC is expected to introduce gold-plated power supply technology in the A16 process.
Future Development
The A14 version with the improved Eneloshoot is scheduled for launch in 2028. In 2029, the A14 manufacturing technology, combined with gold-plated power supply, aims to deliver enhanced performance.
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